| 摘要 |
An automated multi-chip module (MCM) handler for automated module testing which employs a module feed employing a plurality of stackable magazines, the leading one of which in an input stack is positively displaced through an indexing device which positively retrieves each MCM and guides it to a test site. The test site includes a mechanism for positively engaging and aligning each MCM before engagement by the associated test contacts. In one embodiment, the test site includes a module locator bar having a first arrangement of alignment pins configured for engagement with a plurality of tooling holes formed in an MCM presented at the test site. The module locator bar may be configured to be replaceable with a second module locator bar having a second, different arrangement of alignment pins such that differently configured MCMs may be accommodated and positively aligned at the test site.
|
