| 摘要 |
The invention concerns a semiconductor component and a method for identifying a semiconductor component that comprises at least one semiconductor substrate equipped with electronic/electromechanical components, which said semiconductor substrate-except for its leads-is embedded in a housing part made of plastic. It is proposed to equip the semiconductor substrate located in the housing part with an identifier located directly or indirectly thereon that makes it possible to distinguish the semiconductor component from other similarly-designed semiconductor components, and which can be read out from outside the housing part using ultrasound. In the case of semiconductor substrates produced in panels, the identifier makes it possible to determine the original position of the semiconductor substrate of a selected semiconductor component on a base substrate on which a plurality of semiconductor substrates were produced, even after the semiconductor substrates have been diced and placed in a housing part.
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