Optical component mounting and interconnect apparatus

摘要

Optoelectronic component mounting and interconnect apparatus is disclosed that includes an optoelectronic mounting plate with a substantially parallepiped-shaped base plate having opposed major surfaces and a mounting edge extending between the major surfaces. A plurality of electrical contact pads are positioned on one of the major surfaces and electrically insulated from each other. One of the electrical contact pads is designed to have an optoelectronic device physically and electrically mounted thereon. A support plate is physically attached to the mounting edge and has electrical traces connected to at least some of the electrical contact pads. An optoelectronic component with two electrical contacts is mounted on a first contact pad with one contact connected to the pad and a second contact connected to a second pad.