Substrate structure

摘要

A substrate 10 includes multiple layers mounted with a mounted part 20 at its surface. A part pad 40 is provided to the substrate 10 to correspond to an electrode of the mounted part 20. A circuit pattern is provided at a layer at an inner portion of the substrate and an electrically conductive portion 60 for electrically connecting the part pad 40 and the circuit pattern right under the part pad 40.