发明名称 Conductive via composition
摘要 A conductive composition for filling a via. The composition is based on total composition and has 4.0-12.0 wt. % organic vehicle and 88.0-96.0 wt. % electrically conductive particles selected from the group consisting of silver and nickel and mixtures thereof.
申请公布号 US6749775(B2) 申请公布日期 2004.06.15
申请号 US20020059630 申请日期 2002.01.29
申请人 CTS CORPORATION 发明人 BLOOM TERRY R.
分类号 H01B1/22;H05K1/09;H05K3/40;(IPC1-7):H01B1/22 主分类号 H01B1/22
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