发明名称 |
Conductive via composition |
摘要 |
A conductive composition for filling a via. The composition is based on total composition and has 4.0-12.0 wt. % organic vehicle and 88.0-96.0 wt. % electrically conductive particles selected from the group consisting of silver and nickel and mixtures thereof.
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申请公布号 |
US6749775(B2) |
申请公布日期 |
2004.06.15 |
申请号 |
US20020059630 |
申请日期 |
2002.01.29 |
申请人 |
CTS CORPORATION |
发明人 |
BLOOM TERRY R. |
分类号 |
H01B1/22;H05K1/09;H05K3/40;(IPC1-7):H01B1/22 |
主分类号 |
H01B1/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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