发明名称 |
Electronic component and method of producing the same |
摘要 |
An electronic component includes via holes having an elongated cross section, which are provided in a ceramic green molded product provided with a plurality of terminal conductors to define external terminal electrodes. Thereby, a portion of each terminal conductor is exposed on the inner wall of a piecing hole. The ceramic molded product is fired to obtain a ceramic sintered product. Then, the sintered product is split along cutting grooves passing through the via-holes, wherein ceramic electronic components are produced.
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申请公布号 |
US6751101(B2) |
申请公布日期 |
2004.06.15 |
申请号 |
US20010004229 |
申请日期 |
2001.11.02 |
申请人 |
MURATA MANUFACTURING CO., LTD. |
发明人 |
SAKAI NORIO |
分类号 |
H01G4/12;H01F27/29;H01G4/232;H01G4/30;H01G4/38;H01L23/053;H01L23/10;H01L23/498;H05K1/03;H05K3/00;H05K3/34;H05K3/40;(IPC1-7):H05K1/02;H05K7/02;H01L23/00 |
主分类号 |
H01G4/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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