| 摘要 |
PURPOSE: Provided is an etching solution, which dissolves nickel, chrome or alloys thereof promptly and prevents copper from etching consequently to prevent thinning of copper lines when used in a printed circuit board. CONSTITUTION: The etching solution comprises an acid component for dissolving nickel, chrome or nickel/chrome alloys, and a copper etching inhibitor component having a function of capturing copper ions. The acid component is at least one selected from the group consisting of sulfuric acid, hydrochloric acid, formic acid, oxalic acid, hydrofluoric acid and acetic acid. The etching solution comprises 1-70 wt% of the acid component and 0.01-20 wt% of the copper etching inhibitor component, based on the total weight of the etching solution. |
