| 摘要 |
PURPOSE: A die bonding apparatus is provided to be capable of reducing the path of action of a worker, preventing the motion of an unwanted part, and attaching a plurality of dies at a time using one oven cure. CONSTITUTION: A die bonding apparatus is provided with the first and second tape attaching part(151), the first and second die bonding part(160), a transfer part(103) for transferring a wafer, and the first and second pre-bake part(106) for hardening an adhesive tape(120). The first and second tape attaching part includes a rill(130) for winding the adhesive tape, a tape exhaust wheel(140), a cutter(107), and a tape transfer(102). The first and second die attaching part includes a wafer support part(108) and a die transfer(104) for transferring a wafer die(110). Preferably, the first tape attaching part, the first die bonding part, the first pre-bake part, the second tape attaching part, the second die bonding part, and the second pre-bake part are sequentially arrayed for carrying out a predetermined process in line.
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