发明名称 COMPOSITION FOR FORMING POROUS INTERLAYER DIELECTRIC THIN FILM COMPRISING NOVEL PORE-GENERATING MATERIAL
摘要 <p>PURPOSE: Provided is a composition for use in an interlayer dielectric thin film for semiconductors, which has a low dielectric constant(k) of 2.5 or less, low hygroscopic property and excellent mechanical properties. CONSTITUTION: The composition for forming a porous interlayer dielectric thin film comprises a pore-generating material containing a Gemini surfactant represented by formula 8, a quaternary alkylammonium salt represented by the formula of NL1L2L3L4X, in which N is a nitrogen atom, X is a halogen atom, and each of L1-L4 independently represents a C1-C30 alkyl, or a mixture thereof; a thermally stable organic or inorganic matrix precursor; and a solvent for dissolving them: wherein each of R1 and R2 independently represents methyl or ethyl; R3 is a C5-C40 alkyl; X is a halogen atom; each r is H, methyl or a C1-C10 alkoxy; j is 0 or 1; n is an integer of 1-12; m is an integer of 0-10.</p>
申请公布号 KR20040049065(A) 申请公布日期 2004.06.11
申请号 KR20020076275 申请日期 2002.12.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JANG, SEOK;KIM, JI MAN;LEE, GWANG HUI;LIM, JIN HYEONG;PARK, JAE GEUN;RYU, I YEOL
分类号 C08J9/26;C08G77/04;C09D5/25;C09D103/00;C09D183/04;H01L21/312;H01L21/316;H01L21/768;(IPC1-7):C08G77/04 主分类号 C08J9/26
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