NEGATIVE THERMAL EXPANSION SYSTEM(NTES) DEVICE FOR COMPENSATING COEFFICIENT OF THERMAL EXPANSION(CTE) OF ELASTOMER COMPOSITE AND CONDUCTIVE ELASTOMER INTERCONNECTION IN MICROELECTRONIC PACKAGING

摘要

PURPOSE: An NTES(Negative Thermal Expansion System) device for compensating CTE(Coefficient of Thermal Expansion) of a elastomer composite and a conductive elastomer interconnection in microelectronic packaging is provided to form negative thermal expansion foams by melting or fixing the NTES without host elastomer. CONSTITUTION: An NTES device(20) include the first double layer and the second double layer. The first double layer includes the first inner layer(22) and the first outer layer(21) made of predetermined material with a smaller CTE than that of the first inner layer. The second double layer includes the second inner layer(24) and the second outer layer(25) made of predetermined material with a smaller CTE than that of the second inner layer. The first and second double layers are connected with each other along peripheries of the inner layers by using a joint(23), so that a cavity(26) is formed between the first and second double layers. At this time, the joint is formed by melting directly the peripheries of the inner layers.