| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate treating apparatus in which the pressure variation in a treatment vessel is properly maintained and, at the same time, the down flow is secured. SOLUTION: In the substrate treating apparatus, a substrate is turned and subjected to a prescribed processing, that includes, a treatment process(1)(washing and drying), a treatment process(2)(cleaning and washing and drying), and a treatment process(3)( etching and washing and drying). The apparatus is provided with an adjustment means that adjusts air quantity supplied through a suction port, an opening/closing means that opens and closes a discharge port and a detection means that detects the air quantity adjusted by the adjustment means. The opening/closing means of the discharge port is controlled in accordance with the air quantity detected by the detection means in such a manner that the pressure variation falls into the prescribed range. Likewise, the adjustment means of the suction port is controlled in accordance with the opening/closing state of the discharge part based on the detection means in such a manner that the pressure variation in the treatment vessel falls into the prescribed range. COPYRIGHT: (C)2004,JPO
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