| 摘要 |
PROBLEM TO BE SOLVED: To provide a coil component which is a lower back type, ensures reliability over thermostructure to lead-free soldering attachment, and can be manufactured without performing conventional fluxing agent cleaning, in a coil device of a lower back type and a surface mounting type of an electromagnetic device which uses a drum core or the like. SOLUTION: In order to realize the coil component of a lower back type, a hole is formed, and the electromagnetic device 122 is inserted in a substrate 121 having a large number of terminals 124 as far as almost the same surface with a bottom surface of the substrate 121 and fixed with adhesive agent 127. A terminal of a coil 123 and the terminal 124 in an upper surface of the substrate are electrically connected by thermo-compression bonding, and the terminal 124 is electrically connected with a terminal 125 of the bottom surface by using a through hole 126. COPYRIGHT: (C)2004,JPO
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