<p>A press-contact terminal (3) is held on the terminal holder (5) of a main housing (6). The lead (12) of the press-contact terminal (3) is soldered to the first surface (10a) of a circuit board (10) after passed through the bottom plate (13) of the main housing (6) and the circuit board (10), and the board (10) is held in a second holding space (11) between the main housing (6) and a second cover housing (8). After the press-contact terminal (3) is press-contacted to a desired position of a coated wire (2) with such a sub-assembled condition kept, a first cover housing (7) is assembled to the main housing (6). A press-contact weight is received by the receiving portion (44) of he second cover housing (8) via the bottom plate (13) of the main housing (6) and the circuit board (10). A positive press-contact can be attained without the bottom plate (13) nor the circuit board (10) inadvertently bending, thus making practically possible an in-housing press-contacting.</p>
