A TRANSPONDER AND A METHOD FOR MANUFACTURING IT

摘要

The present invention relates to a transponder comprising a substrate (1), which includes a circuitry pattern (3) and an integrated circuit on a chip (2) having a location on the substrate (1), and a cover layer (4) attached to the substrate (1). At the location of the chip (2) there is a hole in the cover layer (4) in which the chip (2) is arranged to be located, and there is a free space outside the chip (2) in the hole. The free space has been filled with ink (5). The present invention also relates to a method for manufacturing such a transponder.