| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a substrate with a speaker and a manufacturing method thereof in which miniaturization is attained as a whole. <P>SOLUTION: A substrate 1 with a speaker is provided with a multilayer printed wiring board part 3 formed by laminating a plurality of thermoplastic films to which patterning is applied, and a speaker 4, a communication means 5 and a drive control means 6 are buried within the multilayer printed wiring board part 3. <P>COPYRIGHT: (C)2004,JPO</p> |
