| 摘要 |
PROBLEM TO BE SOLVED: To conform the lamination relation of a transferred layer to a substrate used when manufacturing the transferred layer including a thin-film device with the relation of the transferred layer to a transfer destination to which the transferred layer is transferred. SOLUTION: A first isolation layer is set up on a substrate, and a thin-film device 140 such as a TFT and the like is formed on that substrate. After the thin-film device 140 is formed, the thin-film device 140 is joined to a primary transfer destination 180 via a second isolation layer 160 composed of water soluble adhesive, organic solvent soluble adhesive, or adhesive that has a stripping action through heating or ultraviolet irradiation, and then, a laser beam is projected from the back of the substrate. This causes a stripping at the first isolation layer which releases the thin-film device 140 from the substrate. Further, an adhesive layer 190 is used at the bottom surface of the thin-film device 140 to join it to a secondary transfer destination 200. After that, the primary transfer destination 180 is removed at the secondary isolation layer 160 as a boundary. COPYRIGHT: (C)2004,JPO |
