| 摘要 |
PROBLEM TO BE SOLVED: To provide a plastic package having high bonding strength of a solder resist mask without overhang on a semiconductor element connection pad and without a plated coat non-adhesion part by performing plating in an electrolytic plating method dispensing with a plated lead wire, and to provide its manufacturing method. SOLUTION: The plastic package 10 has the semiconductor element connection pad 14 formed to continue with a wiring pattern 13 by etching a Cu metal layer 12 of the upper face side of a resin substrate 11, an outside terminal connection pad 15 on the lower face side, and a via 17 connecting wiring patterns 13 and 13a of upper and lower faces. The semiconductor element connection pad 14, the upper surface of the lower face side wiring pattern 13a and the side of the semiconductor element connection pad 14 are covered with an Ni and Au plating coat 18 by the electrolytic plating method. Current for plating is passed to a metal layer 12a of the lower face side, the plated lead wire does not exist, and the Ni and Au plating coat 18 is not applied to the upper face side except for the semiconductor element connection pad 14. COPYRIGHT: (C)2004,JPO
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