发明名称 LAMINATED AND BONDED STRUCTURE OF THIN PLATE-LIKE COMPONENT
摘要 PROBLEM TO BE SOLVED: To prevent the contamination of a surrounding area by reducing the quantity of an adhesive which is protruded outward at pressure jointing when the adhesive is applied to mating surfaces of plates 11-14 to be laminated. SOLUTION: An air release hole 38 of the plate 13, which is provided as a layer on the lowermost-layer plate 14, is formed in a position which overlaps a part of an expanded adhesive reservoir part 42 of the plate 14 in a plan view; the hole 38 of the plate 12, which is provided as a layer on the plate 13, is formed in a position which overlaps a part of the reservoir part 42 of the plate 13 in the plan view; and an air release hole 36 of the plate 11, which is provided as a layer on the plate 12, is formed in a position which overlaps a part of the reservoir part 42 of the plate 12 in the plan view. In this case, at least the axes of adjacent upper and lower air release holes are set to be horizontally displaced so as not to correspond to each other. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004160874(A) 申请公布日期 2004.06.10
申请号 JP20020330450 申请日期 2002.11.14
申请人 BROTHER IND LTD 发明人 ITO ATSUSHI
分类号 B41J2/16;B41J2/045;B41J2/055;(IPC1-7):B41J2/16 主分类号 B41J2/16
代理机构 代理人
主权项
地址