发明名称 |
VACUUM MOUNTING METHOD AND DEVICE FOR MEMS (MICRO ELECTRO MECHANICAL SYSTEM) ON SUBSTRATE |
摘要 |
PROBLEM TO BE SOLVED: To provide a vacuum mounting method and a device for MEMS on a substrate where the vacuum is controlled at a desired level and maintained at an original vacuum level even after a specified time. SOLUTION: A semiconductor substrate 30 where many MEMSs are formed and a lid member 20 consisting of a glass plate where a getter is adhered to a cavity are mutually faced in a vacuum chamber, and then a inert gas is provided from a gas injecting part connected to the vacuum chamber. The vacuum is controlled to be a specified level by controlling the gas injecting part 120 and a gas exhausting part 150. When the vacuum is stabilized, the lid member 20 is heated and then the semiconductor substrate 30 and the lid member 20 are bonded by applying a high voltage to the lid member under a condition that the lid member is heated at a specified temperature. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004160648(A) |
申请公布日期 |
2004.06.10 |
申请号 |
JP20030378222 |
申请日期 |
2003.11.07 |
申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
JUNG KYU-DONG;JUN CHAN-BONG;CHOI HYUNG;KANG SEOK-JIN;HONG SEOG-WOO;CHUNG SEOK-WHAN;LEE MOON-CHUL;LEE EUN-SUNG |
分类号 |
B81C3/00;B81B7/00;H01L21/52;H01L23/02;(IPC1-7):B81C3/00 |
主分类号 |
B81C3/00 |
代理机构 |
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代理人 |
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地址 |
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