PHOTOCURING RESIN COMPOSITION, MEDICAL DEVICE USING SAME AND METHOD FOR MANUFACTURING SAME

摘要

A novel photocuring composition which is highly sensitive and can be cured by a light in a wide wavelength range including ultraviolet light and visible light is disclosed. This photocuring composition can be sufficiently cured through a little exposure and can be adequately formed into a fine pattern when used as a resist. The cured product of this photocuring composition is excellent in heat resistance and insulating properties. A negative photoresist composition using such a photocuring composition is also disclosed. A method for simply and highly accurately producing a polyimide thin film to be used in medical devices and a medical device comprising such a polyimide thin film are further disclosed. The photocuring composition is characterized by containing (A) a carbon cluster having a photosensitizing action and/or a derivative thereof, (B) a compound having a plurality of heterocycles in the molecule, and if necessary, (C) a non-photosensitive resin.