| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain a high-frequency module showing superior electrical characteristics and a communication system having the same, by surely performing ground connection for high-frequency components mounted on a multilayer substrate. <P>SOLUTION: Intermediate ground electrodes Gg1, Gg2, Gm1, Gm2, Go1, Go2 are provided between upper-surface ground electrodes Gq1, Gq2 and a common ground electrode Gd, for mounting high-frequency components 21, 22 on the upper surface of a multilayer substrate 1. With regard to the number of via-hole conductors interconnecting each ground electrodes, the number of via-hole conductors in between the intermediate ground electrodes Gg1, Gg2, Gm1, Gm2, Go1, Go2 and the common ground electrode Gg, is larger than the number of via-hole conductors between the upper-surface ground electrodes Gq1, Gq2 and the intermediate ground electrodes Gg1, Gg2, Gm1, Gm2, Go1, Go2. <P>COPYRIGHT: (C)2004,JPO</p> |
