POLISHING MATERIAL SLURRY, POLISHING METHOD, SUBSTRATE, AND PRODUCING METHOD OF THE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a polishing material slurry which achieves surface polishing with high surface evenness, small surface roughness and excellent precision hardly causing surface microscratches, surface micropits, or the like, and besides, achieves a high polishing speed.

SOLUTION: The polishing material slurry comprises a cerium oxide-containing rare earth oxide as the principal component, an anionic surfactant, and a nonionic surfactant and has a pH≥11.

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