发明名称 CUTTING METHOD FOR MULTI-LAYER PLATE MEMBER AND MANUFACTURING METHOD FOR DISPLAY DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a cutting method for a multi-layer plate member capable of easily cutting a multi-layer platy member structured in multi-level with a convenient means by oppositely placing a transparent plate member via a gap and to provide a manufacturing method for a display device. <P>SOLUTION: The multi-layer platy member 10 structured in multi-level by oppositely placing a lower transparent substrate 1 composed of a transparent member such as a glass or the like, an intermediate transparent substrate 2, and an upper transparent substrate 3 via respective gaps is formed and a laser beam 21 is focused so that the laser beam 21 generated from a laser beam generating device 20 is cast on the surface of the intermediate transparent substrate 2 and the laser beam 21 is cast on the line to be cut of the intermediate transparent substrate 2, and an external force is imparted in the orthogonal direction against the platy surface of the multi-layer plate member 10 and only the intermediate transparent substrate is cut in the orthogonal direction against the plate surface along the line to be cut. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004160499(A) 申请公布日期 2004.06.10
申请号 JP20020330023 申请日期 2002.11.13
申请人 SONY CORP 发明人 HATTORI MITSUO;SANO YUKIHIRO
分类号 G02F1/1333;B23K26/00;B23K26/40;C03B33/07;C03B33/09;(IPC1-7):B23K26/00;G02F1/133 主分类号 G02F1/1333
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