SEMICONDUCTOR DEVICE AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To improve the state of a surface opposite from a surface where a terminal electrode is provided suitably to automated mounting operation as to a chip on board flip-chip bonding type semiconductor device.

SOLUTION: The reverse surface of a chip 1 exposed on the top surface side of the semiconductor device SD is roughened to weaken reflected light until signal reception by a photodetecting element and imaging by an imaging element become possible. Here, the roughness of the chip reverse surface 2 is such that the surface is ground with a grindstone of No.1200.

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