发明名称 |
CASE STRUCTURE OF ONBOARD ELECTRONIC APPARATUS |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic substrate for an onboard electronic apparatus which is excellent in heat radiation characteristics/waterproofness/heat resistance/vibration proofness. <P>SOLUTION: An electronic substrate 7 is temporarily secured to the annular peripheral wall 6 of a cover 1 of frame retardant resin. A connector connection pin 2 is soldered to the electronic substrate 7. The electronic substrate 7 is sandwiched between a heat-conductive base 8 and the annular peripheral wall 6 and screwed for fixing. A generated heat of a heating component 9 on the electronic substrate 7 is propagated and dispersed in the base 8. The annular peripheral wall 6 is provided with an annular groove 6a in which a sealing material 11 is inserted. The base 8 is provided with an annular protrusion 13 which engages with the annular groove 6a. <P>COPYRIGHT: (C)2004,JPO</p> |
申请公布号 |
JP2004166413(A) |
申请公布日期 |
2004.06.10 |
申请号 |
JP20020330178 |
申请日期 |
2002.11.14 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
AZUMI ISAO;WATANABE TETSUJI |
分类号 |
H02G3/16;B60R16/02;B60R16/023;H05K5/00;H05K5/06;H05K7/20;(IPC1-7):H02G3/16 |
主分类号 |
H02G3/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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