发明名称 CASE STRUCTURE OF ONBOARD ELECTRONIC APPARATUS
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an electronic substrate for an onboard electronic apparatus which is excellent in heat radiation characteristics/waterproofness/heat resistance/vibration proofness. <P>SOLUTION: An electronic substrate 7 is temporarily secured to the annular peripheral wall 6 of a cover 1 of frame retardant resin. A connector connection pin 2 is soldered to the electronic substrate 7. The electronic substrate 7 is sandwiched between a heat-conductive base 8 and the annular peripheral wall 6 and screwed for fixing. A generated heat of a heating component 9 on the electronic substrate 7 is propagated and dispersed in the base 8. The annular peripheral wall 6 is provided with an annular groove 6a in which a sealing material 11 is inserted. The base 8 is provided with an annular protrusion 13 which engages with the annular groove 6a. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004166413(A) 申请公布日期 2004.06.10
申请号 JP20020330178 申请日期 2002.11.14
申请人 MITSUBISHI ELECTRIC CORP 发明人 AZUMI ISAO;WATANABE TETSUJI
分类号 H02G3/16;B60R16/02;B60R16/023;H05K5/00;H05K5/06;H05K7/20;(IPC1-7):H02G3/16 主分类号 H02G3/16
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