发明名称 Method for manufacturing semiconductor device
摘要 A method for manufacturing a semiconductor device wherein a cylindrical capacitor is formed by selectively etching an oxide film in a cell area for preventing bridging between cells during a wet etching process of the oxide film in the cell area is described herein. A step difference between the interlayer insulating film formed in the cell area and the interlayer insulating film formed in the peripheral circuit area is minimized by covering the peripheral circuit area by the photoresist film and selectively etching the oxide film in the cell area to form a cylindrical capacitor, thereby simplifying the manufacturing process. In addition, bridging between the cells is prevented by performing a simple wet etching process using a single wet station, without performing a separate dry etching process for removing the oxide film and the photoresist film pattern, thereby improving the yield of the device.
申请公布号 US2004110340(A1) 申请公布日期 2004.06.10
申请号 US20030603895 申请日期 2003.06.25
申请人 KIM GYU HYUN;YOON HYO GEUN;CHOI` GEUN MIN 发明人 KIM GYU HYUN;YOON HYO GEUN;CHOI` GEUN MIN
分类号 H01L21/308;H01L21/304;H01L21/306;H01L21/311;H01L21/316;H01L21/8242;H01L27/108;(IPC1-7):H01L21/824;H01L21/302;H01L21/461 主分类号 H01L21/308
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