发明名称 Lamination process of packaging substrate
摘要 In a lamination process, a plurality of substrate layers are stacked on one another, a topmost substrate layer having an opening therein. A fill material is formed under liquid form in the opening, and is solidified. Thereafter, the substrate layers are heated and pressed between two pressing plates in a press-bonding process, the fill material receiving a pressure of the pressing plates. The pressing plates have planar pressing surfaces, which therefore prevents alteration of the cavity shape and size.
申请公布号 US2004108058(A1) 申请公布日期 2004.06.10
申请号 US20020065980 申请日期 2002.12.06
申请人 KUO JEN-I;DA SU-JUINN;JEN SHUH-SEN 发明人 KUO JEN-I;DA SU-JUINN;JEN SHUH-SEN
分类号 (IPC1-7):B32B31/00 主分类号 (IPC1-7):B32B31/00
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