FLEXIBLE CIRCUIT BOARD FOR STACKING SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A flexible circuit board for stacking a semiconductor package and a manufacturing method thereof are provided to prevent the delamination of an adhesive layer and simplify the structure of the board by forming a polyimide tape at one surface alone of a metal line and a liquid photo solder resist layer at its opposite surface. CONSTITUTION: A flexible circuit board for stacking a semiconductor package is provided with a polyimide tape(301), an adhesive layer(302) formed on the polyimide tape, and a metal line(305) formed on the adhesive layer. The flexible circuit board further includes a photo solder resist layer(304) coated on the metal line and a pair of outer adhesive layers(307,308) formed at the upper and lower surface of the resultant structure.