| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board on which the electrode of an electronic component can be connected firmly to a soldering pad. SOLUTION: After an insulating substrate 1 on which the soldering pad 3 is formed is prepared, an electroless-plated copper layer 3a is formed on the surface of the substrate 1 in a coating state, and a plating resist layer 11 having an opening 11a for exposing the soldering pad forming portion of the copper layer 3a, is formed on the layer 3a. Then an electroplated copper layer 3b and an electroplated nickel layer 5 are successively formed on the exposed portion of the copper layer 3a. After the resist layer 11 is peeled off, in addition, the soldering pad 3 is formed by etching off the copper layer 3a except the soldering pad forming portion, and a solder-resistant resin layer 4 is formed in a coating state. Finally, the pad 3 is coated with an electroless-plated gold layer 6. COPYRIGHT: (C)2004,JPO
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