METHOD FOR MANUFACTURING COPPER FOIL FOR PRINTED CIRCUIT BOARD

摘要

PROBLEM TO BE SOLVED: To provide a method for manufacturing a copper foil for a printed circuit board, which does not use nickel for a metal layer. SOLUTION: The method for manufacturing the copper foil for the printed circuit board is characterized by cathodic treatment for the foil in a plating solution containing cobalt and titanium. The copper foil for the printed circuit board may be chromate-treated and be treated with a silane coupling agent. COPYRIGHT: (C)2004,JPO