发明名称 Copper-clad laminate
摘要 A copper-clad laminate is composed of a copper foil and an aromatic polyimide film placed thereon, in which the copper foil is bonded to the polyimide film at a bonding strength of >=500 N/m and the polyimide film shows a light transmittance of >=40% for a light of wavelength of 600 nm and a haze of >=30% [the light transmittance and haze are values measured after the copper foil is removed by etching].
申请公布号 US2004110015(A1) 申请公布日期 2004.06.10
申请号 US20030622471 申请日期 2003.07.21
申请人 UBE INDUSTRIES, LTD. 发明人 NARUI KOHJI;YAMAMOTO NOBUYUKI;ANNO TOSHIHIKO
分类号 B32B15/08;H05K1/03;H05K3/02;H05K3/38;(IPC1-7):B32B15/08 主分类号 B32B15/08
代理机构 代理人
主权项
地址