发明名称 RADIATION HINGE STRUCTURE FOR ELECTRONIC DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To increase strength of a hinge structure for providing the radiation hinge structure for an electronic device which prevents a trouble such as breakage of a heat pipe. <P>SOLUTION: A radiation hinge member 7 is arranged in a connection part between a pair of housings 1 and 2 capable of opening/closing mutually, while the heat pipe 19 is connected to the radiation hinge member 7, and heat of a CPU 16 arranged in one housing 1 is radiated to the other housing 2 side via the heat pipe 19 and the radiation hinge member 7. A hinge structure 3 guiding opening/closing of both housings 1 and 2 is arranged independently of the heat pipe 19 and positioned to be fixed to the radiation hinge member 7 while an opening/closing axial line L is matched with the rotation center of the heat pipe 19. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004164667(A) 申请公布日期 2004.06.10
申请号 JP20040005590 申请日期 2004.01.13
申请人 FURUKAWA ELECTRIC CO LTD:THE 发明人 SASAKI CHIKA;MAEKAWA HIROAKI;SOTANI JIYUNJI;OMI MASARU;TSUKADA ISAO;ARIMOTO TORU
分类号 H05K5/02;G06F1/16;G06F1/20;H05K7/20;(IPC1-7):G06F1/20 主分类号 H05K5/02
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