发明名称 |
RADIATION HINGE STRUCTURE FOR ELECTRONIC DEVICE |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To increase strength of a hinge structure for providing the radiation hinge structure for an electronic device which prevents a trouble such as breakage of a heat pipe. <P>SOLUTION: A radiation hinge member 7 is arranged in a connection part between a pair of housings 1 and 2 capable of opening/closing mutually, while the heat pipe 19 is connected to the radiation hinge member 7, and heat of a CPU 16 arranged in one housing 1 is radiated to the other housing 2 side via the heat pipe 19 and the radiation hinge member 7. A hinge structure 3 guiding opening/closing of both housings 1 and 2 is arranged independently of the heat pipe 19 and positioned to be fixed to the radiation hinge member 7 while an opening/closing axial line L is matched with the rotation center of the heat pipe 19. <P>COPYRIGHT: (C)2004,JPO</p> |
申请公布号 |
JP2004164667(A) |
申请公布日期 |
2004.06.10 |
申请号 |
JP20040005590 |
申请日期 |
2004.01.13 |
申请人 |
FURUKAWA ELECTRIC CO LTD:THE |
发明人 |
SASAKI CHIKA;MAEKAWA HIROAKI;SOTANI JIYUNJI;OMI MASARU;TSUKADA ISAO;ARIMOTO TORU |
分类号 |
H05K5/02;G06F1/16;G06F1/20;H05K7/20;(IPC1-7):G06F1/20 |
主分类号 |
H05K5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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