| 摘要 |
PROBLEM TO BE SOLVED: To suppress the generation of a chipping upon cutting a work as much as possible and facilitate washing after taking out a chip component. SOLUTION: The work 1 is pasted onto an ultraviolet ray curing type adhesive agent layer 4 applied on a glass plate 3 having an adhesive power under a condition that ultraviolet beams are not irradiated, while an underlying adhesive 5 is interposed between the glass plate 3 and the ultraviolet ray curing type adhesive agent layer 4, and the work 1 is cut on a hard glass plate 3 into the shape of a lattice. However, the cutting is limited up to a depth of the glass plate 3 via the ultraviolet ray curing type adhesive agent layer 4. After the cutting, ultraviolet ray is irradiated by an ultraviolet ray irradiating means 14 to eliminate the adhesive power of the ultraviolet ray curing type adhesive agent layer 4 and, thereafter, the chip component 2 is taken out by a vacuum attraction nozzle 15. COPYRIGHT: (C)2004,JPO |
