| 摘要 |
PROBLEM TO BE SOLVED: To obtain a printed circuit board which can reduce skew by minimizing the influence of reflection characteristic of a through-hole. SOLUTION: On the surface layer of a back board substrate 30, the surface layer signal wires 6a, 6b are provided in different lengths according to difference in the lengths of the connector wires 3a, 3b, and these surface layer signal wires 6a, 6b are connected to the connector wires 3a, 3b. A digital signal a generated by the circuit on a daughter board substrate 10 reaches a through-hole 2a via an internal layer signal wire 1a wired in the internal layer of the daughter board substrate 10, and moreover it is transmitted to the internal signal wire 5a of the back board substrate 30 via the connector wire 3a, surface layer signal wire 6a, and a through-hole 4a. The digital signal a is further transferred to an internal layer signal wire 1a' via a through-hole 4a', a surface layer signal wire 6a', a connector wire 3a', and a through-hole 2a'. COPYRIGHT: (C)2004,JPO |
