发明名称 |
ELECTROLYTIC COPPER FOIL AND COPPER CLAD LAMINATE USING THE ELECTROLYTIC COPPER FOIL |
摘要 |
PROBLEM TO BE SOLVED: To provide an electrolytic copper foil for solving the problems of warpage, twist, and dimensional stability of a copper-clad laminate clad with the electrolytic copper foil and to provide an inspection method for insuring quality. SOLUTION: The electrolytic copper foil used has such properties that when the electrolytic copper foil having such low-temperature annealability that the crystal structure of a copper-clad laminate using the electrolytic copper foil is recrystallized by the heat hysteresis accumulated in producing the laminate and exhibiting an elongation as high as 18% or higher in a hot atmosphere at 170°C is subjected to an age hardening heat treatment in a hot atmosphere of 170°C, the maximum rate of decrease in the maximum tensile strength falls within the range of the age hardening heat treatment time of 5 to 10 min and the amount of change in the tensile strength calculated from the tensile strength values at age hardening heat treatment times of 5 min and 10 min in the hot atmosphere of 170°C in a [tensile strength] vs. [age hardening time] curve where the ordinates represent tensile strengths, and the abscissae represent age hardening times is 3 kg/mm<SP>2</SP>or larger. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004162180(A) |
申请公布日期 |
2004.06.10 |
申请号 |
JP20030391529 |
申请日期 |
2003.11.21 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
TAKAHASHI NAOTOMI;HIRASAWA YUTAKA |
分类号 |
B32B15/08;C22F1/00;C22F1/08;C25D1/04;(IPC1-7):C25D1/04 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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