发明名称 RESIN COMPOSITION HAVING EXCELLENT MOLDABILITY AND GAS BARRIER PROPERTY AND PACKAGING MATERIAL
摘要 PROBLEM TO BE SOLVED: To provide a resin composition shortening the induction time to oxygen absorption in a temperature region not higher than normal temperature without deteriorating excellent moldability and gas barrier properties and having a high oxygen absorption rate and especially excellent initial barrier properties. SOLUTION: The resin composition has excellent moldability and gas barrier properties. The resin composition comprises a thermoplastic resin A, an oxidizable organic component B, an oxidizable organic component C having a higher oxidation rate than that of the oxidizable organic component B and a transition metal catalyst D. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004161796(A) 申请公布日期 2004.06.10
申请号 JP20020325891 申请日期 2002.11.08
申请人 TOYO SEIKAN KAISHA LTD 发明人 KITANO YOSHIHIRO;KIKUCHI ATSUSHI;YAMADA TOSHIKI
分类号 B65D81/26;B65D65/40;C08K3/24;C08K5/00;C08L101/00;(IPC1-7):C08L101/00 主分类号 B65D81/26
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