发明名称 |
RESIN COMPOSITION HAVING EXCELLENT MOLDABILITY AND GAS BARRIER PROPERTY AND PACKAGING MATERIAL |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition shortening the induction time to oxygen absorption in a temperature region not higher than normal temperature without deteriorating excellent moldability and gas barrier properties and having a high oxygen absorption rate and especially excellent initial barrier properties. SOLUTION: The resin composition has excellent moldability and gas barrier properties. The resin composition comprises a thermoplastic resin A, an oxidizable organic component B, an oxidizable organic component C having a higher oxidation rate than that of the oxidizable organic component B and a transition metal catalyst D. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004161796(A) |
申请公布日期 |
2004.06.10 |
申请号 |
JP20020325891 |
申请日期 |
2002.11.08 |
申请人 |
TOYO SEIKAN KAISHA LTD |
发明人 |
KITANO YOSHIHIRO;KIKUCHI ATSUSHI;YAMADA TOSHIKI |
分类号 |
B65D81/26;B65D65/40;C08K3/24;C08K5/00;C08L101/00;(IPC1-7):C08L101/00 |
主分类号 |
B65D81/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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