| 摘要 |
The invention relates to a process of assembly of at least two silicon substrates. The method comprises: a step of placing in contact a first silicon substrate (9) with a second silicon substrate (10), the first and second substrates (9, 10) being substantially non-transparent for a wavelength lambda of laser radiation (R), and a step of illuminating the first silicon substrate (9) with a laser beam of wavelength lambda to create a fusion path (21), along the laser beam axis (A1-A2), in the thickness of the first substrate (9) and in all or part of the thickness of the second substrate (10). The invention is applied to the sealing of cavities and of mechanical or electrical joints situated at the interface of two silicon substrates.
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