CARRIER WITH MULTI-VOLUME DIAPHRAGM FOR POLISHING SEMICONDUCTOR WAFER AND POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a carrier which is capable of maintaining control so as to provide a plurality of pressurized areas through all the rear surface of a semiconductor wafer.

SOLUTION: The carrier 12 includes a rigid board 34 which is connected to one or more diaphragms formed of flexible material to form gaps 50 and 52 that are each equipped with a surface coming into contact with the rear surface of a wafer 56 and can be pressurized. Conduits 28a and 28c are adopted to selectively pressurize the gaps 50 and 52 of the diaphragms. An inter-partition wall gap 54 which is formed between a part of the certain diaphragm and a part of the other partition wall or the semiconductor wafer 56 can be provided on the carrier 12. A dedicated conduit 28b used for selectively connecting a pressurized fluid feed source or a vacuum pressure feed source to the inter-diaphragm gap 54 is connected to the inter-diaphragm gap 54. In operation, a pressure and/or a vacuum pressure is applied so as to chuck the wafer 56 through one or more gaps and to pressurize the gaps in a polishing process.

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