ELECTRONIC COMPONENT MOUNTING STRUCTURE AND MANUFACTURING METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To provide a manufacturing method of an electronic component mounting structure in which an interlayer insulating film on a semiconductor chip is easily flattened in the electronic component mounting structure having a structure in which the semiconductor chip and the like are embedded in the interlayer insulating film on a base substrate.

SOLUTION: The method includes a process for forming a wiring pattern 28b in a part except for a mounting region on a body to be mounted 30a on which an electronic component 11 is mounted, a process for mounting the electronic component 11 on the mounting region of the body to be mounted 30a by turning a face where a connection terminal 12 is formed upward, and a process for forming an insulating film 30b covering the electronic component 11 and the wiring pattern 28b.

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