| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is constituted to cope with a further increase in the number of external terminals, and to provide a method of manufacturing the device. <P>SOLUTION: This semiconductor device 10 is provided with a semiconductor chip 30 having a first main surface 36 provided with a plurality of electrode pads 34, a second main surface 38 opposed to the surface 36, and a plurality of side faces 37 between the first and the second main surfaces 36 and 38, an expanded section 20 surrounding the chip 30 in a state where the section 20 is brought into contact with the side faces 37 of the chip 30, and an insulating film 40 formed to expose the electrode pads 34. This device 10 is also provided with a plurality of wiring patterns 42 respectively electrically connected to the electrode pads 34 and led out to the topside of the expanded section 20 from the pads 34, and a plurality of external terminals 47 provided on the wiring patterns 42 in an area including the topside of the expanded section 20. <P>COPYRIGHT: (C)2004,JPO</p> |
