发明名称 POWER MODULE EQUIPPED WITH TEMPERATURE SENSOR
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a power module equipped with a temperature sensor wherein assembling of the temperature sensor is not so complicated, and parts such as fitting screw, wiring, connector, etc. can be eliminated. <P>SOLUTION: The power module is provided with a printed circuit board 1 and a surface-mounting temperature sensor 2 that is mounted onto the printed circuit board 1. A first conductive pattern 1b is provided in a section with which the bottom of the temperature sensor 2 is in contact, and a second conductive pattern 1c corresponding to the first conductive pattern 1b is provided on the rear surface of the printed circuit board 1, and then a number of through holes 1d are formed to connect the first and the second conductive patterns 1b and 1c with each other. The temperature sensor has such a structure that, when the printed circuit board 1 is dipped in a solder tank, a solder is projected to the side of the first conductive pattern 1b through the through hole 1d and it is brought into contact with the bottom of the temperature sensor 2, and a heat sink 3 of a power element is in contact with the second conductive pattern 1c. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004165404(A) 申请公布日期 2004.06.10
申请号 JP20020329167 申请日期 2002.11.13
申请人 YASKAWA ELECTRIC CORP 发明人 HARA KENJI
分类号 H01L23/34;H01L23/40;(IPC1-7):H01L23/34 主分类号 H01L23/34
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