发明名称 Semiconductor device and manufacturing method for the same
摘要 A storage node in a capacitor of a semiconductor device is formed of: an inner conductor in a columnar form having bottom, side and top surfaces; and an outer conductor, located on the bottom (between the bottom surface and the semiconductor substrate), side and top surfaces of the inner conductor, having a different material from that of the inner conductor. The outer conductor is formed of a metal film such as of Ru having a film thickness of about 40 nm to 80 nm. The inner conductor is formed of a film, such as a TiN film, a TaN film, a WN film or the like, having a high adhesion to the metal film such as of Ru. With this configuration, it is possible to provide a semiconductor device provided with a capacitor of which the capacitance is obtained.
申请公布号 US2004108534(A1) 申请公布日期 2004.06.10
申请号 US20030455325 申请日期 2003.06.06
申请人 RENESAS TECHNOLOGY CORP. 发明人 TSUNOMURA TAKAAKI;TAKEUCHI MASAHIKO
分类号 H01L27/108;H01L21/02;H01L21/8242;H01L27/04;(IPC1-7):H01L27/108 主分类号 H01L27/108
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