发明名称 |
ELECTRONIC PART WITH IMPROVED THROUGH HOLE TO REDUCE SIZE OF PRODUCT AND IMPROVE CONNECTION RELIABILITY OF CONDUCTOR |
摘要 |
<p>PURPOSE: An electronic part is provided to reduce the size of a product and improve the connection reliability of a conductor by improving the structure of a through hole. CONSTITUTION: A through hole(40) is formed in a substrate(10). A conductor(31) for connecting electrically one side of the substrate with the other side of the substrate is filled in the through hole. The through hole includes a major axis diameter(D3) at one side of the substrate and a minor axis diameter(D4) at the other side of the substrate. The through hole is satisfied with l<(D3/D4) <=5.</p> |
申请公布号 |
KR20040048849(A) |
申请公布日期 |
2004.06.10 |
申请号 |
KR20030087077 |
申请日期 |
2003.12.03 |
申请人 |
TDK CORPORATION |
发明人 |
SASAKI SATOSHI;TACHIMOTO KAZUSHI;HOMMA MITSUNAO |
分类号 |
H01L41/22;H01F17/00;H01G4/228;H01L41/047;H01L41/083;H05K1/11;(IPC1-7):H01L41/22 |
主分类号 |
H01L41/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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