发明名称 ELECTRONIC PART WITH IMPROVED THROUGH HOLE TO REDUCE SIZE OF PRODUCT AND IMPROVE CONNECTION RELIABILITY OF CONDUCTOR
摘要 <p>PURPOSE: An electronic part is provided to reduce the size of a product and improve the connection reliability of a conductor by improving the structure of a through hole. CONSTITUTION: A through hole(40) is formed in a substrate(10). A conductor(31) for connecting electrically one side of the substrate with the other side of the substrate is filled in the through hole. The through hole includes a major axis diameter(D3) at one side of the substrate and a minor axis diameter(D4) at the other side of the substrate. The through hole is satisfied with l<(D3/D4) <=5.</p>
申请公布号 KR20040048849(A) 申请公布日期 2004.06.10
申请号 KR20030087077 申请日期 2003.12.03
申请人 TDK CORPORATION 发明人 SASAKI SATOSHI;TACHIMOTO KAZUSHI;HOMMA MITSUNAO
分类号 H01L41/22;H01F17/00;H01G4/228;H01L41/047;H01L41/083;H05K1/11;(IPC1-7):H01L41/22 主分类号 H01L41/22
代理机构 代理人
主权项
地址