发明名称 |
SUBSTRATE FIXING APPARATUS AND SUBSTRATE PROCESSING APPARATUS BY USING THE SAME |
摘要 |
PURPOSE: A substrate fixing apparatus and a substrate processing apparatus are provided to reduce a process badness generated at a boundary surface mismatched by vibration applied from the outside. CONSTITUTION: A combination surface(115) of the first stage piece(110) and a combination surface(125) of the second stage piece(120) have a curve for performing a protrusion and depression combination with each other, respectively. At the first combination surface(115), at least one protrusion member(115a) is formed and at the second combination surface(125) facing to the first combination surface(115), a combination groove member(125a) for combining with the protrusion member(115a) is formed.
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申请公布号 |
KR20040048694(A) |
申请公布日期 |
2004.06.10 |
申请号 |
KR20020076644 |
申请日期 |
2002.12.04 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, BONG U;NAM, HYO HAK |
分类号 |
G02F1/13;(IPC1-7):G02F1/13 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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