| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is constituted to cope with a further increase in the number of external terminals, and to provide a method of manufacturing the device. <P>SOLUTION: This semiconductor device has a base body frame 20 having a first face 20a, a second face 20b opposed to the face 20a, and an opening 22, a first main surface 36 provided with a plurality of electrode pads 34, and a second main surface 38. This device is also provided with a semiconductor chip 30 disposed in the opening 22, an insulating film 40 formed on the first face 20a of the frame 20 and the first main surface 36 of the device, and a plurality of wiring patterns 42 led out to the topside of the first face 20a of the frame 20 from the electrode pads 34. In addition, this device is also provided with sealed sections 44 formed on the patterns 42 and insulating film 40, and a plurality of external terminals 47 provided on the patterns 42 in an area including the topside of the frame 20. <P>COPYRIGHT: (C)2004,JPO |
