| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the cost and the size of a packaging structure of a semiconductor package such as a sensor package. <P>SOLUTION: This packaging structure (30, 130, 230) for a semiconductor device (72) can be surface-mounted on the mounting surface of a circuit board, and is equipped with a substrate (32) which has a first side (44) facing away from the mounting surface and a second side (46) on the same side as the mounting surface in the packaging structure, a cutout (48) in the second side of the substrate, and a semiconductor die (34). The semiconductor die is installed in the cutout, and has a first side and a second side. The first side faces away from the mounting surface, and a portion (74) of the first side is bonded to the substrate in the cutout. <P>COPYRIGHT: (C)2004,JPO |
