| 摘要 |
PROBLEM TO BE SOLVED: To provide a moistureproof bag and a method for packing a semiconductor device which effectively prevents the semiconductor device from absorbing moisture by shortening the time for a desiccating agent being exposed to open air. SOLUTION: A moistureproof bag 20 for packing a semiconductor is provided with a moistureproof outside bag 21 with a mouth part 24, an inside bag 22 forming a sealed space 23 in the bag 21, and a desiccating agent 25 which is sealed in the space 23 to be stored in the bag 21 and is opened by the semiconductor device. COPYRIGHT: (C)2004,JPO |
