| 摘要 |
PROBLEM TO BE SOLVED: To provide a single-wafer processing apparatus, capable of enhancing the uniformity of the processing within the wafer surface by keeping the uniformity of the temperature distribution high within the surface of a loading table. SOLUTION: The single-wafer processing apparatus carries out a prescribed processing, by loading the object W on a thin-plate loading table 58 inside a processing chamber 36, by making the lift pins 70 ascend and descend, and heating the loading table with a heater lamp 108 underneath the loading table, to indirectly heat the object, wherein the lift pins are arranged to support the peripheral edges of the object; while pin insertion parts 60, for passing the ascending and descending lift pins, are formed in the loading table at positions corresponding to the edges. In this way, adverse effects on the distribution characteristics of the heated temperature of the loading table by the light of the heater lamp radiating through the pin insertion parts are greatly suppressed. COPYRIGHT: (C)2004,JPO |
