| 摘要 |
PROBLEM TO BE SOLVED: To provide a device manufacturing method which can print on one side of a substrate with improved precision after aligning the substrate by referring to the markers provided on the other side of the substrate without using additional hardware. SOLUTION: This device manufacturing method comprises a process of preparing a first substrate W having a first surface 10a and a second surface 10b, a process of forming a pattern composed of at least one inversion alignment marking (1-8) on the first surface of the first substrate, a process of providing a protective layer 11 on the alignment marking, a process of joining the first surface of the first substrate to a second substrate CW, a process of locally etching the first substrate to the protective layer to form a trench 17 around the inversion alignment marking, and a process of using a lithographic projection apparatus having a front/rear alignment unit to align the substrates by referring to the alignment marking which is enclosed by the trench and to form at least one patterned layer 15 on the second surface. COPYRIGHT: (C)2004,JPO |
