| 摘要 |
PROBLEM TO BE SOLVED: To overcome a problem that the strength deteriorates by the diffusion of a copper component contained in a wiring layer into a low-melting brazing material due to the heat generating in connecting an electronic component via the low-melting point brazing material, when a defect-free film is needed to form on the wiring layer of the surface of a wiring board using a plating film, such as a tin plating film, which can melt at low temperatures. SOLUTION: The wiring board 4 comprises an insulating substrate 1 composed of glass ceramics, and the wiring layer 2 which is formed on/in the substrate 1 and mainly composed of copper and to which electrodes of an electronic component 3 are connected via the low-melting brazing material 5. In the wiring board 4, a thermally treated copper-tin alloy layer 6 and a thermally treated silver-tin or gold-tin alloy layer 7 are sequentially formed on the surfaces of the regions of the wiring layer 2 to which the electrodes are connected via the low-melting brazing material 5. It is possible to effectively prevent the copper component contained in the wiring layer 2 from diffusing into the low-melting brazing material 5, when the low-melting brazing material 5 is used to connect the wiring layer 2. COPYRIGHT: (C)2004,JPO |
